Combining FIB sequential cross-sectioning with TEM for small Defect Analysis in SRAM array

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 309-313

  Wang, Nathan ^a   Fang, Rei ^a  

^a CYPRESS SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATIC TESTING; CHEMICAL MECHANICAL POLISHING; CHEMICAL REACTIONS; CHEMICAL VAPOR DEPOSITION; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; SCANNING ELECTRON MICROSCOPY; STATIC RANDOM ACCESS STORAGE; TRANSMISSION ELECTRON MICROSCOPY;

DEFECT FORMATION; FOCUSED ION BEAMS (FIB); PASSIVE VOLTAGE;

DEFECTS;

EID: 1542330619     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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2. A. N. Campbell, Fault Localization with the Focused Ion Beam System, ISTFA'97 Workshop, 1997, P. 180.
3. D. Luo, X. Song, Proceedings of ISTAFA'97.
4. S. Tsuji et al., The Solid Films, 281-282(1996) 562.
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6. S. Morris et al., Proceedings of ISTFA'91, P. 417.
7. K. J. Giewont et al., J. Vac. Sci. Technol. B 15(4), Jul/Aug 1997, P.916.
8. ASM committee, Metals Handbook, American Society for metals, 8.3, 1983, P.259.