Techniques to Remove the C4 Die from a Ceramic Package

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1998, Pages 303-306

  Mahanpour, M ^a   Gray, A ^a   Hulog, J ^a   Chang, P ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC PACKAGES; PHOTON EMISSION ANALYSIS;

CERAMIC MATERIALS; ENCAPSULATION; METALLIZING; MICROSCOPIC EXAMINATION; MILLING MACHINES; MOUNTINGS; PACKAGING; POLISHING; THERMAL EFFECTS; WHEELS;

FAILURE ANALYSIS;

EID: 1542300999     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. N.M. Wu, K. Weaver, J.H. Lin, "Failure Analysis From Back Side of Die" ISTFA 1996.
2. S. Chan, B. Shinseki, C. Barutha, T. Kha, "Infrared Imaging and Backside Failure Analysis Techniques on Multilayer CMOS Technology" IPFA 1997.
3. th edition 1997.
4. T.Ishii, M.Inoue, N. Asatani, K.Naitoh, J. Mitsuhashi, "Functional Failure Analysis of Logic LSIs from Backside of the Chip and its Verification by Logic Simulation" IPFA 1997.