BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 365-375

  Colvin, Jim ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

BACKSIDE EMISSION MICROSCOPY; WIRE BONDING;

BANDWIDTH; CHARGE COUPLED DEVICES; ELECTRIC CONNECTORS; FAILURE ANALYSIS; FLIP CHIP DEVICES; INFRARED IMAGING; SILICON; THICKNESS MEASUREMENT;

INTEGRATED CIRCUITS;

EID: 1542300888     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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