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Volumn 767, Issue , 2003, Pages 305-312

Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; FLOW OF FLUIDS; INTERFACES (MATERIALS); PRESSURE MEASUREMENT; SILICON WAFERS; SLURRIES;

EID: 0242322610     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (11)
  • 1
    • 0034174259 scopus 로고    scopus 로고
    • Mechanism for subambient interfacial pressures while polishing with liquids
    • Levert, J., S. Danyluk, and J. Tichy, Mechanism for subambient interfacial pressures while polishing with liquids. Journal of Tribology, 2000. 122: p. 450.
    • (2000) Journal of Tribology , vol.122 , pp. 450
    • Levert, J.1    Danyluk, S.2    Tichy, J.3
  • 3
    • 0034480717 scopus 로고    scopus 로고
    • Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing
    • Shan, L., Levert, J., Meade, L., Tichy, J., Danyluk, S., Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing. Journal of Tribology, 2000. 122: p. 539-543.
    • (2000) Journal of Tribology , vol.122 , pp. 539-543
    • Shan, L.1    Levert, J.2    Meade, L.3    Tichy, J.4    Danyluk, S.5
  • 8
    • 85040875608 scopus 로고
    • Cambridge, UK: Cambridge University Press
    • Johnson, K.L., Contact Mechanics. 1985, Cambridge, UK: Cambridge University Press.
    • (1985) Contact Mechanics
    • Johnson, K.L.1
  • 10
    • 0017825563 scopus 로고
    • An Average Flow Model for Determining Effects of Three-Dimensional Roughness on Partial Hydrodynamic Lubrication
    • Patir, N. and H. Cheng, An Average Flow Model for Determining Effects of Three-Dimensional Roughness on Partial Hydrodynamic Lubrication. ASME J. Lubrication Technology. 1978. Vol. 100(1): p. 12-17.
    • (1978) ASME J. Lubrication Technology , vol.100 , Issue.1 , pp. 12-17
    • Patir, N.1    Cheng, H.2
  • 11
    • 0242367665 scopus 로고    scopus 로고
    • Predicting the Hydrodynamic Slurry Pressure in CMP: Modeling and Experiments
    • Higgs III, C., Ng, S.H., Yoon, I., Yap, L., and S. Danyluk. Predicting the Hydrodynamic Slurry Pressure in CMP: Modeling and Experiments. In Preparation for the Journal of Tribology, 2003.
    • (2003) Journal of Tribology
    • Higgs C. III1    Ng, S.H.2    Yoon, I.3    Yap, L.4    Danyluk, S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.