Crucial applications addressed via: Fundamental ALD advances

Solid State Technology

Volumn 48, Issue 2, 2005, Pages 45-48

  Seidel, Tom ^a   Kim, Gi Youl ^a   Srivastava, Anu ^a   Karim, Zia ^a  

^a AIXTRON Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC LAYER DEPOSITION (ALD); GAP DIELECTRICS; TIME-PHASED MULTILEVEL FLOW (TMF); TRIMETHYLALUMINUM (TMA);

ADSORPTION; ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; DIELECTRIC MATERIALS; DYNAMIC RANDOM ACCESS STORAGE; HAFNIUM COMPOUNDS; MIM DEVICES; POLYSILICON; SILICA; SILICON; SURFACE TREATMENT;

THIN FILMS;

EID: 14944374488     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

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