Hybrid bendable stamp copies for molding fabricated by nanoimprint lithography

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 605-611

  Schift, Helmut ^a   Park, Sunggook ^a   Gobrecht, Jens ^a   Meier, Fabian ^b   Raupach, Werner ^b   Vogelsang, Konrad ^a  

^a PAUL SCHERRER INSTITUTE   (Switzerland)

^b UNIVERSITY OF APPLIED SCIENCES AND ARTS NORTHWESTERN SWITZERLAND   (Switzerland)

Author keywords

Ceramic; Injection molding; Nanoimprint; Stamp copy; Thermoplastic polymer

Indexed keywords

CERAMIC MATERIALS; CROSSLINKING; DIFFRACTIVE OPTICS; ETCHING; FRICTION; INJECTION MOLDING; STAMPING; SURFACE ROUGHNESS; THERMOPLASTICS;

NANOIMPRINT; SHEAR FORCES; SILICON MOLDING TOOLS; STAMP COPY;

NANOTECHNOLOGY;

EID: 14944354865     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.077     Document Type: Conference Paper

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