Processing of alumina-niobium interfaces via liquid-film-assisted joining

Welding Journal (Miami, Fla)

Volumn 84, Issue 3, 2005, Pages

  McKeown, J T ^a   Sugar, J D ^a   Gronsky, R ^a   Glaeser, A M ^a  

^a University of California Berkeley   (United States)

Author keywords

Alumina; Area Fracture of Contact; Copper Film; Diffusion Brazing; Fracture Path; Liquid Film Assisted Joining; Niobium

Indexed keywords

DIFFUSION BRAZING; LIQUID-FILM-ASSISTED JOINING (LFAJ); PARTIAL TRANSIENT LIQUID PHASE (PTLP) BONDING; WEIBULL MODULUS;

ALUMINA; ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); BRAZING; CERAMIC MATERIALS; COPPER; DIFFUSION; EVAPORATION; NIOBIUM; SURFACE ROUGHNESS; THERMAL EXPANSION;

INTERFACES (MATERIALS);

EID: 14844348787     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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