Thermal analysis of silicon micromachining based micro hotplates

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 26, Issue 1, 2005, Pages 192-196

  Yu, Juan ^a   Tang, Zhen'an ^a   Chan, Philip C H ^b   Wei, Guangfen ^a   Wang, Liding ^a   Yan, Guizhen ^c  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c PEKING UNIVERSITY   (China)

Author keywords

Finite element analysis; Heat conduction; Micro hotplate; Silicon micromachining

Indexed keywords

CHEMICAL SENSORS; SILICON; THERMOANALYSIS;

BACK SIDE BULK SILICON MICROMACHINING; FRONT SIDE BULK SILICON MICROMACHINING; GAS SENSOR; MICRO HOTPLATE (MHP); SILICON SURFACE MICROMACHINING;

MICROMACHINING;

EID: 14844346770     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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