-
2
-
-
0002167090
-
Predicted square error: A criterion for automatic model selection
-
S.J. Farlow Marcel Dekker New York
-
A.R. Barron Predicted square error a criterion for automatic model selection S.J. Farlow Self-Organizing Methods in Modeling GMDH Type Algorithm 1984 Marcel Dekker New York
-
(1984)
Self-Organizing Methods in Modeling: GMDH Type Algorithm
-
-
Barron, A.R.1
-
3
-
-
0015142058
-
Polynomial theory of complex systems
-
A.G. Ivakhnenko Polynomial theory of complex systems IEEE Trans. Syst. Man Cybern. 1 4 1971 364 378
-
(1971)
IEEE Trans. Syst. Man Cybern.
, vol.1
, Issue.4
, pp. 364-378
-
-
Ivakhnenko, A.G.1
-
5
-
-
0034273196
-
An investigation of modeling of the machining database in turning operations
-
B.Y. Lee, Y.S. Tarng, and H.R. Lii An investigation of modeling of the machining database in turning operations J. Mat. Proc. Technol. 105 2000 1 6
-
(2000)
J. Mat. Proc. Technol.
, vol.105
, pp. 1-6
-
-
Lee, B.Y.1
Tarng, Y.S.2
Lii, H.R.3
-
6
-
-
0344035524
-
A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process
-
Y.Y. Lin, and S.P. Lo A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process Int. J. Adv. Manuf. Technol. 22 2003 401 409
-
(2003)
Int. J. Adv. Manuf. Technol.
, vol.22
, pp. 401-409
-
-
Lin, Y.Y.1
Lo, S.P.2
-
7
-
-
2942687851
-
A study of a finite element model for chemical-mechanical polishing process
-
Y.Y. Lin, and S.P. Lo A study of a finite element model for chemical-mechanical polishing process Int. J. Adv. Manuf. Technol. 23 2004 644 650
-
(2004)
Int. J. Adv. Manuf. Technol.
, vol.23
, pp. 644-650
-
-
Lin, Y.Y.1
Lo, S.P.2
-
8
-
-
0001611894
-
Optimization of computer controlled polishing
-
F. Preston Optimization of computer controlled polishing Glass Tech. 11 1927 214 219
-
(1927)
Glass Tech.
, vol.11
, pp. 214-219
-
-
Preston, F.1
-
10
-
-
0028444787
-
Tribiology analysis of chemical-mechanical polishing
-
S.R. Runnels, and L.M. Eyman Tribiology analysis of chemical-mechanical polishing J. Electrochem. Soc. 141 6 1994 1698 1701
-
(1994)
J. Electrochem. Soc.
, vol.141
, Issue.6
, pp. 1698-1701
-
-
Runnels, S.R.1
Eyman, L.M.2
-
11
-
-
0006247470
-
Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing
-
Runnels, S.R., Renteln, P., 1993. Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing. Dielectric Sci. Technol. pp. 110-121.
-
(1993)
Dielectric Sci. Technol.
, pp. 110-121
-
-
Runnels, S.R.1
Renteln, P.2
-
12
-
-
0041773196
-
Chemical mechanical polishing of inter-level dielectrics: Models for removal rate and planarity
-
SEMATECH, Austin, TX
-
Sivaram, S., Tolles, R. Bath, H. Lee E., Leggett, R., 1992. Chemical mechanical polishing of inter-level dielectrics: models for removal rate and planarity. Technical Report, SEMATECH, Austin, TX.
-
(1992)
Technical Report
-
-
Sivaram, S.1
Tolles, R.2
Bath, H.3
Lee, E.4
Leggett, R.5
-
13
-
-
0031245898
-
Stress distribution in chemical-mechanical polishing
-
C. Srinivasa-Murthy, D. Wang, S.P. Beaudoin, T. Bibby, K. Holland, and T.S. Cale Stress distribution in chemical-mechanical polishing Thin Solid films 308 1997 533 537
-
(1997)
Thin Solid Films
, vol.308
, pp. 533-537
-
-
Srinivasa-Murthy, C.1
Wang, D.2
Beaudoin, S.P.3
Bibby, T.4
Holland, K.5
Cale, T.S.6
-
14
-
-
0031100738
-
Von Mises stress in chemical-mechanical polishing processes
-
D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, and T. Cale von Mises stress in chemical-mechanical polishing processes J. Electrochem. Soc. 144 3 1997 1122 1127
-
(1997)
J. Electrochem. Soc.
, vol.144
, Issue.3
, pp. 1122-1127
-
-
Wang, D.1
Lee, J.2
Holland, K.3
Bibby, T.4
Beaudoin, S.5
Cale, T.6
-
15
-
-
0026204737
-
A two-dimensional process model for CMP planarization
-
J. Warnock A two-dimensional process model for CMP planarization J. Electrochem. Soc. 138 8 1991 2398 2402
-
(1991)
J. Electrochem. Soc.
, vol.138
, Issue.8
, pp. 2398-2402
-
-
Warnock, J.1
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