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Volumn 18, Issue 3, 2005, Pages 373-381

Modeling of chemical mechanical polishing process using FEM and abductive network

Author keywords

Abductive network; Finite element method; Nonuniformity; Stress; Wafer

Indexed keywords

COMPUTER NETWORKS; COMPUTER SIMULATION; CORRELATION THEORY; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MATHEMATICAL TECHNIQUES; REMOVAL; SOLVENTS; STRESS ANALYSIS;

EID: 14844295026     PISSN: 09521976     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engappai.2004.09.008     Document Type: Article
Times cited : (5)

References (15)
  • 2
    • 0002167090 scopus 로고
    • Predicted square error: A criterion for automatic model selection
    • S.J. Farlow Marcel Dekker New York
    • A.R. Barron Predicted square error a criterion for automatic model selection S.J. Farlow Self-Organizing Methods in Modeling GMDH Type Algorithm 1984 Marcel Dekker New York
    • (1984) Self-Organizing Methods in Modeling: GMDH Type Algorithm
    • Barron, A.R.1
  • 3
    • 0015142058 scopus 로고
    • Polynomial theory of complex systems
    • A.G. Ivakhnenko Polynomial theory of complex systems IEEE Trans. Syst. Man Cybern. 1 4 1971 364 378
    • (1971) IEEE Trans. Syst. Man Cybern. , vol.1 , Issue.4 , pp. 364-378
    • Ivakhnenko, A.G.1
  • 5
    • 0034273196 scopus 로고    scopus 로고
    • An investigation of modeling of the machining database in turning operations
    • B.Y. Lee, Y.S. Tarng, and H.R. Lii An investigation of modeling of the machining database in turning operations J. Mat. Proc. Technol. 105 2000 1 6
    • (2000) J. Mat. Proc. Technol. , vol.105 , pp. 1-6
    • Lee, B.Y.1    Tarng, Y.S.2    Lii, H.R.3
  • 6
    • 0344035524 scopus 로고    scopus 로고
    • A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process
    • Y.Y. Lin, and S.P. Lo A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process Int. J. Adv. Manuf. Technol. 22 2003 401 409
    • (2003) Int. J. Adv. Manuf. Technol. , vol.22 , pp. 401-409
    • Lin, Y.Y.1    Lo, S.P.2
  • 7
    • 2942687851 scopus 로고    scopus 로고
    • A study of a finite element model for chemical-mechanical polishing process
    • Y.Y. Lin, and S.P. Lo A study of a finite element model for chemical-mechanical polishing process Int. J. Adv. Manuf. Technol. 23 2004 644 650
    • (2004) Int. J. Adv. Manuf. Technol. , vol.23 , pp. 644-650
    • Lin, Y.Y.1    Lo, S.P.2
  • 8
    • 0001611894 scopus 로고
    • Optimization of computer controlled polishing
    • F. Preston Optimization of computer controlled polishing Glass Tech. 11 1927 214 219
    • (1927) Glass Tech. , vol.11 , pp. 214-219
    • Preston, F.1
  • 10
    • 0028444787 scopus 로고
    • Tribiology analysis of chemical-mechanical polishing
    • S.R. Runnels, and L.M. Eyman Tribiology analysis of chemical-mechanical polishing J. Electrochem. Soc. 141 6 1994 1698 1701
    • (1994) J. Electrochem. Soc. , vol.141 , Issue.6 , pp. 1698-1701
    • Runnels, S.R.1    Eyman, L.M.2
  • 11
    • 0006247470 scopus 로고
    • Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing
    • Runnels, S.R., Renteln, P., 1993. Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing. Dielectric Sci. Technol. pp. 110-121.
    • (1993) Dielectric Sci. Technol. , pp. 110-121
    • Runnels, S.R.1    Renteln, P.2
  • 12
    • 0041773196 scopus 로고
    • Chemical mechanical polishing of inter-level dielectrics: Models for removal rate and planarity
    • SEMATECH, Austin, TX
    • Sivaram, S., Tolles, R. Bath, H. Lee E., Leggett, R., 1992. Chemical mechanical polishing of inter-level dielectrics: models for removal rate and planarity. Technical Report, SEMATECH, Austin, TX.
    • (1992) Technical Report
    • Sivaram, S.1    Tolles, R.2    Bath, H.3    Lee, E.4    Leggett, R.5
  • 15
    • 0026204737 scopus 로고
    • A two-dimensional process model for CMP planarization
    • J. Warnock A two-dimensional process model for CMP planarization J. Electrochem. Soc. 138 8 1991 2398 2402
    • (1991) J. Electrochem. Soc. , vol.138 , Issue.8 , pp. 2398-2402
    • Warnock, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.