Packaging influence on acceleration sensitivity of pyroelectric infrared detectors

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 297-302

  Gerlach, Gerald ^a   Shvedov, Dmitry ^a   Norkus, Volkmar ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; COMPUTER SIMULATION; ELECTRIC CHARGE; FINITE ELEMENT METHOD; INFRARED DETECTORS; MATHEMATICAL MODELS; PERMITTIVITY; PYROELECTRICITY; SENSORS;

DIELECTRIC DISPLACEMENT; ELECTROMECHANICAL COUPLING; MICROPHONY; PYROLELECTRIC SENSORS;

ELECTRONICS PACKAGING;

EID: 14844293152     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. 3 In: K.Chau, S.Dimitrijev (Hrsg.): Device and Process Technologies for MEMS and Microelectronics. Proceedings of SPIE Vol. 3892. Brisbane, 233-240
2. J. Drescher, H. Balke, H.-A. Bahr, G. Milde, G. Gerlach: "Finite element modeling of the thermo-electro-mechanical coupling in pyroelectric infrared sensor arrays." In: MOEMS and Miniaturized Systems II. Proceedings of SPIE, Vol. 4562. San Francisco, 22-24 October 2001. SPIE 2001. 333-338.
3. F.J. von Preissig and E.S. Kim: "Topics in Finite-Element Modeling of Piezoelectric MEMS", In: "MSM 2000, Modeling and Simulation of Microsystems", San Juan/Puerto Rico, 269-272