Dynamic reduced electrothermal model for Integrated Power Electronics Modules (IPEM)

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 477-490

  Hernandez Mora M ^a   Gonzalez J E ^b   Velez Reyes M ^a   Ortiz Rodriguez J M ^a   Pang, Y ^c   Scott, E ^c  

^a UNIVERSITY OF PUERTO RICO   (Puerto Rico)

^b Santa Clara University   (United States)

^c State University   (United States)

Author keywords

Integrated Power Electronics; Lumped Thermal Capacitance; Reduced Thermal Model

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER AIDED SOFTWARE ENGINEERING; FINITE DIFFERENCE METHOD; HEAT TRANSFER; MATHEMATICAL MODELS; MOSFET DEVICES; SEMICONDUCTOR MATERIALS;

ELECTROTHERMAL INTERACTIONS; INTEGRATED POWER ELECTRONICS; LUMPED THERMAL CAPACITANCE; REDUCED THERMAL MODEL;

POWER ELECTRONICS;

EID: 13944271108     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1827264     Document Type: Article

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