Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 15, Issue 1, 2005, Pages 73-95

  Nithiarasu, P ^a   Massarotti, N ^b   Mathur, J S ^c  

^a SWANSEA UNIVERSITY   (United Kingdom)

^b UNIVERSITY OF CASSINO AND SOUTHERN LAZIO   (Italy)

^c SURFACE ENGINEERING DIVISION   (India)

Author keywords

Convection; Heat transfer; Solder

Indexed keywords

COMPRESSIBILITY; COMPUTER SIMULATION; COOLING; ELECTRONICS PACKAGING; INCOMPRESSIBLE FLOW; MATHEMATICAL MODELS; NAVIER STOKES EQUATIONS; NUSSELT NUMBER; POISSON EQUATION; PRINTED CIRCUIT BOARDS; REYNOLDS NUMBER; SOLDERING ALLOYS; TURBULENT FLOW;

ARTIFICIAL COMPRESSIBILITY (AC); CHARACTERISTIC BASED SPLIT (CBS); ISOTHERMAL FLOW; SOLDER BALLS;

FORCED CONVECTION;

FORCED CONVECTION; HEAT TRANSFER; MATHEMATICAL ANALYSIS; MODEL;

EID: 13844319187     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615530510571967     Document Type: Article

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