Chlorine-based reactive ion etching process to pattern platinum for MEMS applications

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 243-254

  Choi, Sung H ^a   Osborn, Jon V ^a   Morgan, Brent A ^a  

^a AEROSPACE CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CARBON DIOXIDE; CHEMICAL MODIFICATION; CHLORINE; DEPOSITION; ELECTRODES; FUEL CELLS; HARDNESS; MELTING; MICROELECTROMECHANICAL DEVICES; MICROWAVES; PLATINUM; SECONDARY ION MASS SPECTROMETRY;

ELECTRICAL CONTACTS; ETCH RATES; MELTING POINTS; METAL ELECTRODES;

REACTIVE ION ETCHING;

EID: 12844261624     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-812-f8.2     Document Type: Conference Paper

References (18)

1. G.V. Samsonov (Ed.) in Handbook of the Physicochemical Properties of the Elements, IFI-Plenum, New York, USA, 1968.
2. th Edition, CRC Press, London, UK, 1995.
3. Webelements on-line chemical and material reference. http://www. webelements.com/webelements/compounds/text/Pt/cl12Pt6-10025657.html
4. MEMSCAP Multi-User MEMS Process (MUMPS) website http://www.memscap.com/ index.html
5. R.C. Cole, R. Robertson, J. Swenson, J.V. Osborn, "MEMS Packaging Techniques Using HF Vapor Release," IMAPS, Reno NV, 2002.
6. Bruce H. Weiller, Peter D. Fuqua and Jon Osborn, "Characterization and Thermal Failure Analysis of a Micro Hot Plate Chemical Sensor," Proceedings of the Electrochemical Society, vol. PV 2002-6, 2002, p. 36-42.
7. Bruce H. Weiller, Peter D. Fuqua, and Jon V. Osborn, "Fabrication, Characterization, and Thermal Failure Analysis of a Micro Hot Plate Chemical Sensor Substrate" Journal of The Electrochemical Society, 151 (3) H59-H65 (2004)
8. D.H. Lewis Jr., S.W. Janson, R.B. Cohen, and E.K. Antonsson, "Digital Micropropulsion," Sensors and Actuators, p. 143-154, 80, 2000.
9. S.W. Janson, H. Helvajian, and K. Breuer, "MEMS, Microengineering and Aerospace Systems," AIAA paper 99-3802, 30th AIAA Fluid Dynamics Conference, Norfolk, VA, June 1999.
10. Jon V. Osborn, RF MEMS Switch, USPTO no. 6, 426, 687, July 20, 2002.
11. G.S. Lodha, S. Pandiz, A. Gupta, R. V. Nandedker, and K. Yamashita, Applied Physics A62, 29, 1996.
12. F. Ulashia, J. Pettic, and D. Mcvitti, Journal of electrochemical Society, vol. 135, No.6, 1521, 1988.2. S.C. McNevin and G.E. Becker, J. Vac. Sci. Technol., B3, 485 (1985)
13. F. Ulashia, J. Pettic, and D. Mcvitti, Journal of electrochemical Society, vol. 135, No.6, 1521, 1988.2. S.C. McNevin and G.E. Becker, J. Vac. Sci. Technol., B3, 485 (1985)
14. R.A. Baker, T.M. Mayer and W.C. Pearson, J. Vac. Sci. Technol., B1, 37 (1983)
15. U. Gerlach-Meyer, J.W. Coburn and E. Kay, Surf. Sci., 103, 177 (1981)
16. J.W. Coburn and H.F. Winters, J. Appl. Phys., 50, 3189 (1979)
17. Gray, I. Tepermeister, and H.H. Sawin, J. Vac. Sci. Technol., B11, 1243 (1993)
18. Steinbruchel, Appl. Phys. Lett., 55, 1960 (1989)