CMP modeling and characterization for polysilicon MEMS structures

Materials Research Society Symposium Proceedings

Volumn 816, Issue , 2004, Pages 209-216

  Tang, Brian ^a   Boning, Duane ^a  

^a USA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DENSITY (SPECIFIC GRAVITY); FAST FOURIER TRANSFORMS; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; POLYSILICON; SURFACE ROUGHNESS;

CHEMICAL MECHANICAL POLISHING (CMP) MODELS; INTEGRATED CIRCUIT (IC) PLANARIZATION; PATTERN DENSITY; PRESTON COEFFICIENTS;

CHEMICAL MECHANICAL POLISHING;

EID: 12744254293     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-816-k7.6     Document Type: Conference Paper

References (11)

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