Atomic layer deposition of aluminum nitride thin films from trimethyl aluminum (TMA) and ammonia

Materials Research Society Symposium Proceedings

Volumn 811, Issue , 2004, Pages 11-16

  Liu, Xinye ^a   Ramanathan, Sasangan ^a   Lee, Eddie ^a   Seidel, Thomas E ^a  

^a AIXTRON Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; AMMONIA; DEPOSITION; MICROSTRUCTURE; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SURFACE ROUGHNESS; THERMAL EFFECTS; THERMAL EXPANSION; X RAY DIFFRACTION ANALYSIS;

ATOMIC LAYER DEPOSITION (ALD); PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD); TRIMETHYL ALUMINUM (TMA); X-RAY REFLECTION (XRR);

THIN FILMS;

EID: 12744253004     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-811-d1.9     Document Type: Conference Paper

References (8)

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