Challenges in Electronic Cooling - Opportunities for Enhanced Thermal Management Techniques - Microprocessor Liquid Cooled Minichannel Heat Sink

International Conference on Microchannels and Minichannels

Volumn 1, Issue , 2003, Pages 951-959

  Schmidt, Roger ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER APPLICATIONS; FRICTION; HEAT LOSSES; HEAT SINKS; MICROPROCESSOR CHIPS; NUSSELT NUMBER; SERVERS; THERMAL CONDUCTIVITY;

ELECTRONIC COOLING; THERMAL MANAGEMENT TECHNIQUES;

COOLING;

EID: 1242331461     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/icmm2003-1001     Document Type: Conference Paper

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