Wafer scale encapsulation of MEMS devices

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 209-212

  Park, Woo Tae ^a   Cho, Junghwa ^a   Li, Holden ^a   Kenny, Thomas W ^a   Candler, Rob N ^a   Li, Huimou J ^a   Partridge, Aaron ^b   Yama, Gary ^b   Lutz, Markus ^b  

^a Stanford University   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; BONDING; CMOS INTEGRATED CIRCUITS; DEPOSITION; DIFFUSION; ELECTRIC CONTACTS; ELECTRIC WIRE; INJECTION MOLDING; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; PASSIVATION; POLYSILICON; RESONATORS; SENSORS; SILICON WAFERS; ELECTRONIC EQUIPMENT MANUFACTURE; PACKAGING; WAFER BONDING;

WAFER SCALE ENCAPSULATION; WIRE BONDING; CHIP AREAS; CHIP SIZES; MEMS PACKAGING; MEMSDEVICES; MOUNTING TECHNIQUES; PACKAGING PROCESS; POST PROCESSING; SEALING LAYERS; WAFER-SCALE; WORKING DEVICE;

ELECTRONICS PACKAGING; CHIP SCALE PACKAGES;

EID: 1242287431     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35032     Document Type: Conference Paper

References (5)

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2. C.Liu, Y.Tai, "Sealing of Micromachined Cavities Using Chemical Vapor Deposition Methods: Characterization and Optimization," J MEMS 8, pp.135-145 (1999).
3. K.S.Lebouitz, A.Mazaheri, R.T.Howe, A.Pisano, "Vacuum Encapsulation of Resonant Devices using Permeable Polysilicon," MEMS'99, pp.470-475 (1999).
4. A. Partridge, A.E. Rice, T.W. Kenny, and M. Lutz, "New Thin Film Epitaxial Polysilicon Encapsulation for Piezoresistive Accelerometers", 2001 MEMS Workshop Proceedings, pp.54-59 (2001).
5. A.Partridge, J.K.Reynolds, B.W.Chui, E.M.Chow, A.M.Fitagerald, L.Zhang, N.I.Maluf, T.W.Kenny, "A High Performance Planar Piezoresistive Accelerometer," JMEMS, vol.9, no.1, pp.58-66 (2000).