Optimization study of a silicon-carbide micro-capillary pumped loop

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 355-361

  Meyer, Laura J ^a,b   Phinney, Leslie M ^b  

^a GE GLOBAL RESEARCH   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Micro Capillary Pumped Loops; Microcoding; Silicon Carbide

Indexed keywords

COOLING; EVAPORATORS; GALLIUM NITRIDE; HEAT FLUX; HEAT PIPES; OPTIMIZATION; SEMICONDUCTOR DIODES; SILICON CARBIDE; BLOOD VESSELS; ELECTRIC POWER SYSTEMS; ELECTRON DEVICES; ELECTRONICS PACKAGING; HEAT ENGINES; MATHEMATICAL MODELS; MULTIPHASE FLOW; TEMPERATURE CONTROL; THERMOELECTRIC EQUIPMENT;

CAPILLARY PUMPED LOOP (CPL); THERMAL ENERGY; THERMAL MANAGEMENT; CAPILLARY PUMPED LOOP; COOLING METHODS; HIGH-POWER DEVICES; HIGH-POWER ELECTRONIC DEVICES; LOOP HEAT PIPE; MICRO-CAPILLARIES; MICROCOOLING; MODEL-BASED; OPERATING TEMPERATURE; OPTIMAL VALUES; OPTIMIZATION CALCULATION; OPTIMIZATION STUDIES; PARAMETRIC STUDY; PETERSON; PIN DIODE; PRESSURE BALANCE; THERMAL MANAGEMENT SYSTEMS; VAPOR LINE; WICKING; WIDE-BAND-GAP SEMICONDUCTOR;

POWER ELECTRONICS; SEMICONDUCTING SILICON COMPOUNDS;

EID: 1242287415     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35138     Document Type: Conference Paper

References (13)

1. I. Mudawar, "Assessment of High-Heat-Flux Thermal Management Schemes," 2000 Inter Society Conference on Thermal Phenomena, pp. 1-20, 2000.
2. C.M. Johnson, N.G. Wright, M.J. Uren, K.P. Hilton, M. Rahimo, D.A. Hinchley, A.P. Knights, D.J. Morrison, A.B. Horsfall, S. Ortolland, and A.G. O'Neill, "Recent Progress and Current Issues in SiC Semiconductor Devices for Power Applications," IEE Proc. -Circuits Devices Syst., Vol. 148, No. 2, pp. 101-108, April 2001.
3. D. Cytrynowicz, M. Hamdan, P. Medis, A. Shuja, H. Henderson, F. Gerner, and E. Golliher, "MEMS Loop Heat Pipe Based on Coherent Porous Silicon Technology," AIP Conference Proceedings, No. 608, pp. 220-232, 2002.
4. D. Trebotich, J. Kirshberg, J. Teng, and D. Liepmann. "Optimization of a MEMS based Micro-Capillary Pumped Loop for Chip-Level Temperature Control," Proceedings of the 2001 Conference on Modeling and Simulation of Microsystems, ISBN 0-9708275-0-4, pp. 262-265, March 19-21, 2001.
5. J. Kirshberg, D. Liepmann, and K. Yerkes, "Micro-Cooler for Chip-Level Temperature Control," SAE Aerospace Power Systems Conference, Mesa, Arizona, pp. 233-237, 1999.
6. J.T. Dickey and G.P. Peterson, "Experimental and Analytical Investigation of a Capillary Pumped Loop, "J. Thermophysics and Heat Transfer, Vol. 8, No. 3, pp. 602-607, 1994.
7. P-C. Chen and W-K. Lin, "The Application of Capillary Pumped Loop for Cooling of Electronic Components," Applied Thermal Engineering, Vol. 21, No. 17, pp. 1739-1754, 2001.
8. T.J. LaClair and I. Mudawar, "Thermal Transients in a Capillary Evaporator Prior to the Initiation of Boiling," Int. J. Heat and Mass Transfer, Vol. 43, No. 21, pp. 3937-3952, 2000.
9. I. Muraoka, F.M. Ramos, and V.V. Vlassov, "Analysis of the Operational Characteristics and Limits of a Loop Heat Pipe with Porous Elements in the Condenser," Int. J. Heat and Mass Transfer, Vol. 44, pp. 2287-2297, 2001.
10. M. Hamdan, D. Cytrynowicz, P. Medis, A. Shuja, F. Gerner, H.T. Henderson, E. Golliher, K. Mellott, and C. Moore, "Loop Heat Pipe (LHP) Development by Utilizing Coherent Porous Silicon (CPS) Wicks," 2002 IEEE Inter Society Conference on Thermal Phenomena, pp. 457-465, 2002.
11. A. Faghri, Heat Pipe Science and Technology, Taylor and Francis, New York, 1995.
12. R.D. Blevins, Applied Fluid Dynamics Handbook, Van Nostrand Reinhold Company, New York, 1984.
13. S. Kakac, R. Shah, and W. Aung, Handbook of Single-Phase Convective Heat Transfer, John Wiley and Sons, 1987.