The application of capillary pumped loop for cooling of electronic components

Applied Thermal Engineering

Volumn 21, Issue 17, 2001, Pages 1739-1754

  Chen, Pin Chih ^a,b   Lin, Wei Keng ^a,b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NONE   (Taiwan)

Author keywords

Capillary pumped loop; CPU; Natural circulation

Indexed keywords

CONDENSER TUBES; COOLING; ELECTRONIC EQUIPMENT; EVAPORATORS; HEAT TRANSFER; MICROPROCESSOR CHIPS; SURFACE PHENOMENA; THERMAL EFFECTS;

CAPILLARY PUMPED LOOP (CPL); NATURAL CIRCULATION;

CAPILLARITY;

EID: 0035546676     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-4311(01)00045-X     Document Type: Article

References (9)

1. Heat pipes for cooling high flux/high power semiconductor chips
2. Investigation of a heat pipe array for convective cooling
3. Thermal solutions to pentium processors in TCP and sub-notebooks
4. The design and testing of the super fiber heat pipes for electronic cooling applications
5. Use of heat pipe/heat sink for thermal management of high performance CPUs
6. Experimental results for capillary loop pipe applied to direct cooling method
7. Experimental and analytical investigation of a capillary pumped loop
8. Experimental and theoretical investigation of a capillary pumped loop with a porous element in the condenser
9. Evaporator heat transfer in a capillary structure heated by a grooved block