Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 457-465

  Hamdan, M ^a   Cytrynowicz, D ^a   Medis, P ^a   Shuja, A ^a   Gerner, F M ^a   Henderson, H T ^a   Golliher, E ^b   Mellott, K ^b   Moore, C ^b  

^a 705 Engineering Research Center   (United States)

^b NASA GLENN RESEARCH CENTER   (United States)

Author keywords

Electronic components; Equations; Fault location; Heat sinks; Pumps; Silicon; Space cooling; Temperature; Thermal conductivity; Thermal force

Indexed keywords

ELECTRIC FAULT LOCATION; ELECTRONIC COOLING; EVAPORATORS; HEAT PIPES; HEAT SINKS; PORE SIZE; POROUS SILICON; PUMPS; SILICON; SPACE APPLICATIONS; TEMPERATURE; THERMAL CONDUCTIVITY OF LIQUIDS; THERMODYNAMIC PROPERTIES;

CONCENTRATED HEAT SOURCES; CONSERVATION EQUATIONS; EFFECTIVE THERMAL CONDUCTIVITY; ELECTRONIC COMPONENT; EQUATIONS; EVAPORATOR TEMPERATURE; SPACE COOLING; THERMAL FORCES;

THERMAL CONDUCTIVITY;

EID: 84950131849     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012492     Document Type: Conference Paper

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