Numerical optimization study for a parallel plate impingement heat sink

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 485-495

  Shah, Amit ^a   Sammakia, Bahgat ^a   Srihari, Hari ^a   Ramakrishna, Koneru ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; ENERGY DISSIPATION; FINS (HEAT EXCHANGE); HEAT RESISTANCE; HYDRAULICS; NUMERICAL METHODS; OPTIMIZATION; SPECIFIC HEAT; THERMAL CONDUCTIVITY; VISCOSITY; DESIGN; ELECTRONICS PACKAGING; FORCED CONVECTION; MIXED CONVECTION; NUMERICAL ANALYSIS; SHAPE OPTIMIZATION;

FLUID VELOCITY; POWER LOSSES; CENTRAL ZONE; FIN MATERIALS; HEAT SINK DESIGN; HYDRAULIC PERFORMANCE; NUMERICAL OPTIMIZATIONS; OPERATING CHARACTERISTICS; PARALLEL PLATES; THERMAL PERFORMANCE; UNIFORM DISTRIBUTION;

HEAT SINKS; FINS (HEAT EXCHANGE);

EID: 1242287142     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35236     Document Type: Conference Paper

References (8)

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7. Shah, A., Sammakia, B., Ramakrishna, K., Srihari, H., "A numerical study of the thermal performance of an impingement heat sink - fin shape optimization", Proceedings - ITherm, San Diego, CA, 2002, pp. 298-306.
8. Sathe S.B. and Sammakia, B. "An Analytical Study Of The Optimized Performance Of An Impingement Heat Sink", Proceedings - National Heat Transfer Conference, Vol. 1, 1995, pp. 43-49.