A numerical study of the thermal performance of an impingement heat sink - Fin shape optimization

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 298-306

  Shah, Amit ^a   Sammakia, Bahgat ^a   Srihari, Hari ^a   Ramakrishna, Koneru ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT RESISTANCE; HEAT TRANSFER; MICROELECTRONICS; MICROPROCESSOR CHIPS; SPECIFIC HEAT; THERMAL EFFECTS; VISCOSITY;

PRESSURE GRADIENT; THERMAL PERFORMANCE;

FINS (HEAT EXCHANGE);

EID: 0036457778     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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