Proposal of lap joint type shear specimen for evaluation of creep deformation properties of solder

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 65, Issue 632, 1999, Pages 894-900

  Sayama, Toshihiko ^a   Takayanagi, Takeshi ^a   Takayanagi, Mitsuhiro ^a   Mori, Takao ^a  

^a NONE

Author keywords

Creep; Electronic device; Finite element method; Lap joint type shear specimen; Reliability; Solder joint; Surface mount technology; Thermal stress

Indexed keywords

EID: 0345815402     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.65.894     Document Type: Article

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