Analysis of phase growth process in Sn/Pb eutectic solder joint

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Sayama, Toshihiko ^a   Takayanagi, Takeshi ^b   Mori, Takao ^c  

^a TOYAMA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

^b Customer Service Engineering Department   (Japan)

^c TOYAMA PREFECTURAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; EUTECTICS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MODELS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; THERMAL CYCLING; THERMAL STRESS; TIN ALLOYS;

TIN LEAD ALLOYS;

ELECTRONICS PACKAGING;

EID: 0342298381     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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8. Sayama, T., Takayanagi, T., Takayanagi, M. and Mori, T., 1998, "Proposal of Lap Joint Type Specimen for Measurement of Creep Properties of Solder," Proc. the 75th. JSME Spring Annual Meeting, No. 98-1, Vol. II, pp. 44-45.
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