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Volumn 2, Issue , 2000, Pages 213-225

Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONICS PACKAGING; FORCED CONVECTION; HEAT RESISTANCE; MATHEMATICAL MODELS; NATURAL CONVECTION; PRINTED CIRCUIT BOARDS; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY OF SOLIDS;

EID: 0033694252     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (20)

References (45)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.