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Volumn 2, Issue , 2000, Pages 213-225
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Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection
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Author keywords
[No Author keywords available]
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Indexed keywords
COOLING;
ELECTRONICS PACKAGING;
FORCED CONVECTION;
HEAT RESISTANCE;
MATHEMATICAL MODELS;
NATURAL CONVECTION;
PRINTED CIRCUIT BOARDS;
TEMPERATURE DISTRIBUTION;
TEMPERATURE MEASUREMENT;
THERMAL CONDUCTIVITY OF SOLIDS;
ELECTRONICS COOLING;
ELECTRONICS THERMAL MANAGEMENT;
JUNCTION TEMPERATURE;
POWER DISSIPATION;
THERMAL TEST;
PRINTED CIRCUIT TESTING;
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EID: 0033694252
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
Times cited : (20)
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References (45)
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