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Volumn 2, Issue , 2003, Pages 443-450
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System and package level thermal optimization of power amplifier modules with application in wireless communication
a
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
ELASTOMERS;
HEAT RESISTANCE;
INFRARED RADIATION;
MATHEMATICAL PROGRAMMING;
MICROELECTRONICS;
POWER AMPLIFIERS;
SYSTEMS ANALYSIS;
THERMAL CONDUCTIVITY;
THERMAL EFFECTS;
TIME DIVISION MULTIPLE ACCESS;
WIRELESS TELECOMMUNICATION SYSTEMS;
ELECTRONICS PACKAGING;
IMPACT RESISTANCE;
MIXED CONVECTION;
NUMERICAL ANALYSIS;
OPTIMIZATION;
PACKAGING;
PLASTICS;
TESTING;
MICROELECTRONIC PACKAGING;
THERMAL PERFORMANCE ENHANCEMENT;
BASELINE DESIGN;
COMMERCIAL APPLICATIONS;
CONDUCTIVE ELASTOMERS;
CURRENT TEST;
HIGH STANDARDS;
HIGH TEMPERATURE;
LOAD BOARD;
MICROELECTRONIC PACKAGE;
MOVING PARTS;
PACKAGE LEVELS;
PACKAGING SOLUTIONS;
PEAK TEMPERATURES;
POWER AMPLIFIER MODULE;
POWER LEVELS;
REFERENCE TEMPERATURE;
SYSTEM LEVELS;
SYSTEMS-LEVEL DESIGN;
TEMPERATURE DIFFERENCES;
TEMPERATURE INCREASE;
TEST CONDITION;
TEST DESIGNS;
THERMAL CHARACTERISTICS;
THERMAL OPTIMIZATION;
THERMAL PERFORMANCE;
THERMAL RESISTANCE;
WIRELESS COMMUNICATIONS;
ELECTRONICS PACKAGING;
DESIGN;
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EID: 1242287029
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35216 Document Type: Conference Paper |
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Times cited : (2)
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References (6)
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