An overview of the NCMS/StorageTek embedded decoupling capacitance project

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 191-196

  Bowles, P H ^b   Charbonneau, R ^a  

^a Sun StorageTek   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CAPACITANCE MEASUREMENT; COST EFFECTIVENESS; ELECTRIC POWER SYSTEMS; INTERFACES (MATERIALS);

CIRCUIT INTEGRATION; COST EFFECTIVE; DE-COUPLING CAPACITANCE; EMBEDDED DECOUPLING; IMPROVE PERFORMANCE; POWER SUPPLY DECOUPLING; QUALIFICATION TESTING; SHORT-TERM PROJECTS;

PACKAGING MATERIALS;

EID: 0038074853     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757310     Document Type: Conference Paper

References (2)

1. "Bypass Capacitors-An Interview with Todd Hubing", Printed Circuit Design Magazine, March, 1998
2. "The Buried CapacitanceTM Design Guide", HADCO Corporation, available at http://www.hadco.com/