Measurement of the constitutive behavior of underfill encapsulants

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 923-931

  Islam, M Saiful ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CAPILLARY FLOW; DELAMINATION; DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; ENCAPSULATION; MICROELECTRONICS; SOLDERED JOINTS; STRAIN; STRESSES; BLOOD VESSELS; CAPILLARITY; CHIP SCALE PACKAGES; CURING; ELECTRONIC EQUIPMENT MANUFACTURE; MATERIALS TESTING; MECHANICAL PROPERTIES; OPTIMIZATION; RELIABILITY ANALYSIS; SPECIMEN PREPARATION; TENSILE TESTING; TORSION TESTING;

CONSTITUTIVE BEHAVIOR; UNDERFILL ENCAPSULANTS; CONSTITUTIVE BEHAVIORS; CREEP DATA; CRITICAL STEPS; ELECTRONIC PACKAGE; EMPIRICAL MODEL; ENCAPSULANTS; FLIP CHIP ASSEMBLIES; HYPERBOLIC TANGENT; MATERIAL PROPERTY; MECHANICAL DESIGN; MECHANICAL RESPONSE; MECHANICAL TESTS; MICRO-SCALES; NON-LINEAR STRESS-STRAIN BEHAVIOR; PROCESS OPTIMIZATION; PROCESSING CONDITION; PRODUCTION EQUIPMENTS; RELIABILITY ASSESSMENTS; RESEARCH EFFORTS; SAMPLE PREPARATION PROCEDURE; SPECIMEN DIMENSION; STRESS-STRAIN BEHAVIORS; THREE PARAMETERS; UNDERFILL MATERIALS; UNDERFILLS; UNIAXIAL TENSIONS;

ELECTRONICS PACKAGING; STRAIN RATE;

EID: 1242264451     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35321     Document Type: Conference Paper

References (7)

1. th Electronic Components and Technology Conference, pp. 1548-1553, Las Vegas, NV, May 21-24, 2000.
2. Qian, Z., Lu, M., Wang, J., and Liu, S., "Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester," Applications of Experimental Mechanics to Electronic Packaging, pp. 105-112, ASME IMECE, Dallas, TX, Nov. 16-21, 1997.
3. Qian, Z., Wang, J., Yang, J., and Liu, S., "Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills," IEEE Transactions on Components and Packaging Technologies, Vol. 22(2), pp. 152-157, 1999.
4. Rao, Y., Shi, S. H., and Wong, C. P., "Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants," IEEE Transactions on Components and Packaging Technologies, Vol. 23(3), pp. 434-439, 2000.
5. Shi, X. Q., Wang, Z. P., Pang, H. L. J., and Zhang, X. R., "Investigation of Effect of Temperature and Strain Rate on Mechanical Properties of Underfill Material by Use of Microtensile Specimens," Polymer Testing, Vol. 21, pp. 725-733, 2002.
6. Andersson, O. and Berkyto, E., "Some Factors Affecting the Stress Strain Characteristics of Paper," Svensk Papperstidning, Vol. 54(13), pp. 437-444, 1951.
7. Yeh, K. C., Considine, J. M., Suhling, J. C., "The Influence of Moisture Content on the Nonlinear Constitutive Behavior of Cellulosic Materials," Proceedings of the 1991 International Paper Physics Conference, TAPPI, pp. 695-711, Kona, Hawaii, September 22-26, 1991.