A bending-to-stretching analysis of the blister test in the presence of tensile residual stress

International Journal of Solids and Structures

Volumn 42, Issue 9-10, 2005, Pages 2771-2784

  Guo, Shu ^a,b   Wan, Kai Tak ^a   Dillard, David A ^a,b  

^a Virginia Polytechnic Institute and State University   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Adhesion; Bending; Blister test; Coating; Delamination; Fracture mechanics; Residual stress; Stretching; Thin film

Indexed keywords

ADHESION; BENDING (DEFORMATION); COATING TECHNIQUES; DELAMINATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; STRETCHING; THIN FILMS;

ADHESION ENERGY; BENDING PLATES; BLISTER TEST; INTERFACIAL FRACTURE ENERGY;

RESIDUAL STRESSES;

EID: 12244265844     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2004.10.007     Document Type: Article

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