High density MLB using additive and build-up process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 399-404

  Enomoto, Ryo ^a   Asai, Motoo ^a   Hirose, Naohiro ^a  

^a IBIDEN CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LSI CIRCUITS; RESINS; THERMAL CYCLING;

MULTILAYERED PRINTED CIRCUIT BOARDS;

PRINTED CIRCUIT BOARDS;

EID: 0032318402     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)