Transient liquid phase bonding of TiAl and Inconel 718

Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics

Volumn 30, Issue 10, 2004, Pages 984-988

  Duan, Huiping ^a   Luo, Jun ^a   Zhang, Tao ^a   Kocak, Mustafa ^b  

^a BEIHANG UNIVERSITY   (China)

^b INSTITUTE OF MATERIALS RESEARCH   (Germany)

Author keywords

Bonding; Inconel; Intermetallics components; Transient liquid phase

Indexed keywords

BONDING; DEFECTS; INTERFACES (MATERIALS); INTERMETALLICS; MECHANISMS; METAL FOIL; MORPHOLOGY;

INCONEL 718; INSERT METAL; INTERMETALLICS COMPONENT; TRANSIENT LIQUID PHASE;

TITANIUM ALLOYS;

EID: 11144246719     PISSN: 10015965     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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