Contactless electrostatic handling of microcomponents

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Volumn 218, Issue 12, 2004, Pages 1795-1806

  Biganzoli, F ^a   Fantoni, G ^b  

^a CNR   (Italy)

^b UNIVERSITY OF PISA   (Italy)

Author keywords

Alignment; Contactless; Electrostatic; Handling; Microassembly

Indexed keywords

ADHESIVES; ELECTRIC CHARGE; ELECTRIC FIELDS; ELECTROSTATICS; MECHANICAL PROPERTIES; PERFORMANCE; PROBLEM SOLVING; VAN DER WAALS FORCES;

CONTACTLESS; ELECTROSTATIC HANDLING; HANDLING; MICROASSEMBLY;

MICROELECTRONICS;

EID: 11144225599     PISSN: 09544054     EISSN: None     Source Type: Journal    
DOI: 10.1177/095440540421801212     Document Type: Conference Paper

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