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Volumn 47, Issue 4, 2005, Pages 977-987
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Rate control for copper tarnishing
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Author keywords
Copper; Copper tarnishing process; Ohmic resistance; Potentiodynamic experiments
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Indexed keywords
COPPER OXIDES;
CURRENT DENSITY;
DISSOLUTION;
ETCHING;
HEAT TREATMENT;
NITRIC ACID;
POLISHING;
COPPER TARNISHING;
POTENTIODYNAMIC POTENTIAL;
RATE CONTROL;
COPPER;
COPPER;
CORROSION RATE;
ETCHING;
INDUSTRIAL APPLICATION;
POLISHING;
REDUCTION;
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EID: 10944261497
PISSN: 0010938X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.corsci.2004.06.026 Document Type: Article |
Times cited : (15)
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References (23)
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