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Volumn 45, Issue 5, 2003, Pages 855-866
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Mechanism of dissolution of a Cu-13Sn alloy in low aggressive conditions
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Author keywords
C. De alloying; C. Passive films; Chronoamperometry; Copper tin alloy; Scanning electron microscopy
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Indexed keywords
CORROSION;
DISSOLUTION;
ENERGY DISPERSIVE SPECTROSCOPY;
POLARIZATION;
SCANNING ELECTRON MICROSCOPY;
SOLUTIONS;
OPEN CIRCUIT POTENTIAL;
COPPER ALLOYS;
COPPER-TIN ALLOY;
CORROSION;
DISSOLUTION;
POLARIZATION;
SODIUM SULFATE;
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EID: 0037401635
PISSN: 0010938X
EISSN: None
Source Type: Journal
DOI: 10.1016/S0010-938X(02)00207-X Document Type: Article |
Times cited : (69)
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References (19)
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