Implementation of active interposer for high-speed and low-cost chip level optical interconnects

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 9, Issue 2, 2003, Pages 452-459

  Mikawa, Takashi ^a   Kinoshita, Masao ^a   Hiruma, Kenji ^a   Ishitsuka, Takeshi ^a   Okabe, Masahiro ^a   Hiramatsu, Seiki ^a   Furuyama, Hideto ^a   Matsui, Teruhito ^a   Kumai, Koichi ^a   Ibaragi, Osamu ^a   Bonkohara, Manabu ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

Active interposer; Metal semiconductor metal (MSM) photodiode; Three dimensional stacked integration; Through hole electrodes; Vertical cavity surface emitting lasers (VCSELs); Waveguide film lamination

Indexed keywords

CROSSTALK; ELECTRODES; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; PHOTODIODES; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR LASERS;

HIGH DENSITY INTERCONNECT; POLYMERIC WAVEGUIDE FILM LAMINATION; THREE DIMENSIONAL STACKING;

OPTICAL INTERCONNECTS;

EID: 10744232722     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2003.814945     Document Type: Article

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