Nickel suicides in semiconductor processing: Thermal budget considerations

Materials Science and Engineering: B

Volumn 114-115, Issue SPEC. ISS., 2004, Pages 46-50

  Ramamurthy, Sundar ^a   Ramachandran, Balasubramanian ^a   Byun, Jeong Soo ^a   Dixit, Tarpan ^a   Hunter, Aaron ^a   Ramanujam, Rajesh ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

CMOS; Nickel suicides; Rapid thermal processing

Indexed keywords

AGGLOMERATION; ANNEALING; CMOS INTEGRATED CIRCUITS; ELECTRIC RESISTANCE; INTERFACIAL ENERGY; SEMICONDUCTOR DEVICES; SILICON WAFERS; SINGLE CRYSTALS; THERMODYNAMIC STABILITY;

NICKEL SILICIDES; RAPID THERMAL PROCESSING; SHEET RESISTANCE; X RAY REFLECTANCE (XRR);

NICKEL COMPOUNDS;

EID: 10644230104     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2004.07.076     Document Type: Conference Paper

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