Recent Developments in Automated Sample Preparation for FESEM

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2003-November, Issue , 2003, Pages 288-296

  Cerchiara, R R ^a   Fischione, P E ^a   Gronksy, J J ^a   Hein, W F ^a   Martin, D D ^a   Matesa, J M ^a   Robins, A C ^a   Smith, D W ^a  

^a E A Fischione Instruments Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; ION BEAMS; IONS; MICROELECTRONICS;

IMAGING TECHNOLOGY; ORIENTATION MAPPING; OXYGEN PLASMAS; PHYSICAL DAMAGES; PLASMA CLEANING; SAMPLE PREPARATION; SAMPLE SURFACE; SEMICONDUCTOR INDUSTRY; SURFACE FREE; TECHNOLOGY-MAPPING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 10444270844     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa2003p0288     Document Type: Conference Paper

References (6)

1. P.E. Fischione et al., Method and Apparatus for Preparing Specimens for Scanning Electron Microscopy, U.S. Patent Application
2. J.I. Goldstein et al., Scanning Electron Microscopy and X-ray Microanalysis, pp 461 - 494, Plenum, New York (1980)
3. T.C. Isabell et al., Microsc. Microanal., 5, 126-135 (1999)
4. 4. J. C. Petrus et al., The SEM Lab, From Logistics to Final Sample Preparation Techniques for SEM Analysis of Semiconductors, IBM Microelectronics, Hopewell Junction, New York
5. S. M. Rossnagel, Handbook of Plasma Processing, p. 290, Noyes Publications, New York (1990)
6. A. J. Schwartz et al., Electron Backscatter Diffraction in Materials Science, Kluwer Academic Publisher (2000)