Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 815-820

  Degryse, D ^a   Vandevelde, B ^a   Stoukatch, S ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; DEFORMATION; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; GOLD; WIRE; YIELD STRESS;

COPPER WIRE BONDINGS; ELECTRICAL CONDUCTANCE; GOLD WIRE BONDINGS; HYDROSTATIC COMPONENTS; LOCAL DEFORMATIONS; LOW K DIELECTRICS; MECHANICAL BEHAVIOR; MECHANICAL SUPPORT;

STRESSES;

EID: 10444235965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271630     Document Type: Conference Paper

References (4)

1. Ming-Dou Ker and Jeng-Jie Peng, "Fully Process-Compatible Layout Design on Bond Pad to Improve Wire Bond Reliability in CMOS ICs" IEEE Transactions on components and packaging technologies, Vol. 25, No. 2 (June 2002), pp. 309-331.
2. st Electronic Components and Technology Conf, Orlando, FL, May. 2001, pp. 965-970.
3. th Annual International Reliability Physics Symposium, Reno, Nevada, 1998, pp. 225-231.
4. Dominiek Degryse, Bart Vandevelde and Eric Beyne, "Mechanical FEM simulation of Bonding Process on Cu LowK wafers," Proceedings of EuroSimE 2003, Aix-en-Provence, France, March 30 - April 2, 2003, pp. 345-351.