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Volumn 1, Issue , 2004, Pages 259-265

Characterization of discrete decoupling capacitors for high-speed digital systems

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY-DEPENDENT CHARACTERIZATION; MULTI-TERMINAL DECOUPLING CAPACITORS; POWER DELIVERY SYSTEMS;

EID: 10444286054     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (13)

References (11)
  • 3
    • 0027146302 scopus 로고
    • Integral decoupling capacitors reduces multichip module ground bounce
    • Mar.
    • T. Takken, "Integral decoupling capacitors reduces multichip module ground bounce," in Proc. IEEE Multichip Module, pp. 79-84, Mar. 1993.
    • (1993) Proc. IEEE Multichip Module , pp. 79-84
    • Takken, T.1
  • 6
    • 0034239060 scopus 로고    scopus 로고
    • Design and performance evaluation of microprocessor packaging capacitors using integrated capacitor-via-plane model
    • Aug.
    • Y.L. Li, T.G.Yew, C.Y.Chung, and D.G Figueroa, "Design and performance evaluation of microprocessor packaging capacitors using integrated capacitor-via-plane model," IEEE trans. on Advanced Packaging, pp. 361-367, vol. 23, no. 3, Aug. 2000.
    • (2000) IEEE Trans. on Advanced Packaging , vol.23 , Issue.3 , pp. 361-367
    • Li, Y.L.1    Yew, T.G.2    Chung, C.Y.3    Figueroa, D.G.4
  • 10
    • 10444251354 scopus 로고    scopus 로고
    • Frequency-domain power-dsitribution measurement - An overview
    • Boston, MA, June
    • I. Novak, "Frequency-domain power-dsitribution measurement - an overview," DesignCon East, Boston, MA, June. 2003.
    • (2003) DesignCon East
    • Novak, I.1
  • 11
    • 0034238542 scopus 로고    scopus 로고
    • Lossy power distribution network with thin dielectric layers and/or thin conductive layers
    • Aug.
    • I. Novak, "Lossy power distribution network with thin dielectric layers and/or thin conductive layers," IEEE Trans.Com., Packag., Manufact. Tchnol., vol. 23, no. 3, pp. 353-360, Aug. 2000.
    • (2000) IEEE Trans.Com., Packag., Manufact. Tchnol. , vol.23 , Issue.3 , pp. 353-360
    • Novak, I.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.