Three dimensional imaging of microelectronic devices using a cross beam FIB

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Volumn , Issue , 2004, Pages 429-435

  Lifshin, Eric ^a   Evertsen, James ^a   Principe, Edward ^b   Friel, John ^c  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b CARL ZEISS SMT AG   (Germany)

^c Princeton Gamma Tech   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D MASS SPECTRAL IMAGES; FOCUSED ION BEAM INSTRUMENTS (FIB); MICROELECTRONIC DEVICES; THREE DIMENSIONAL IMAGING;

DETECTORS; ELECTRIC POTENTIAL; ION BEAMS; MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY; SPECTRUM ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

IMAGING TECHNIQUES;

EID: 10444285415     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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