Heat transfer in water-cooled silicon carbide milli-channel heat sinks for high power electronic applications

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 2, 2003, Pages 327-335

  Bower, C ^a   Ortega, A ^a   Skandakumaran, P ^a   Vaidyanathan, R ^b   Phillips, T ^b  

^a University of Arizona   (United States)

^b Advanced Ceramics Research Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ENERGY DISSIPATION; FLOW OF FLUIDS; FRICTION; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; MASS TRANSFER; NUSSELT NUMBER; PRESSURE DROP; REYNOLDS NUMBER; SILICON CARBIDE; THERMAL CONDUCTIVITY;

MULTICHANNEL HEAT SINKS; SINGLE PHASE FLOW;

POWER ELECTRONICS;

EID: 1842430432     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-43374     Document Type: Conference Paper

References (14)

1. Ortega, A., 2003, "Air cooling of electronic components: review of research developments in the period 1981-2001 and their impact on our understanding of cooling limits", 2003 ASME IMECE, Washington D.C. Nov. 2003, paper # IMECE 2003-42412
2. Tuckerman, D.B., and R.F.W. Pease, 1981, "High-performance heat sinking for VLSI", IEEE Electron Dev. Lett. 2, pp. 126-129
3. Phillips, R.J., 1990, "Micro-channel heat sinks, in A. Bar-Cohen A.D. Kraus (Eds.)"Advances in Thermal Modelling of Electronic Components and Systems vol. 2, ASME, New York, Chapter 3
4. Lu, T.J., and M.F. Ashby, 1998, "Heat transfer in open celled metal foams", Acta Mater, 46, pp. 3619-3635
5. Knight, R.W., and J.S. Gooding, D.J. Hall, 1991, "Optimal thermal design of forced convection heat sinks-Analytical" ASME Journal of Electronics Packaging, 113, pp. 313-321
6. Koh, J.C.Y., and R. Colony, 1986, "Heat transfer of microstructure for integrated circuits", Int. Comm Heat Mass Transfer, 13, pp. 89-98
7. Kim, S.J., D Kim, and D.Y. Lee, 2000, "On the local thermal equilibrium in microchannel heat sinks" Int Journal of Heat Mass Transfer, 43, pp. 1735-1748
8. Kim, S., J. D Kim, 1999, "Forced convection in microstructure for integrated circuits" ASME J. Heat Transfer, 121, pp. 635-645
9. Mudawar, I., 2000, "Assessment of high heat flux thermal management schemes", IEEE Inter Society Conference on Thermal Phenomena
10. Vafai, K., and L. Zhu, 1999, "Analysis of two-layered micro-channel heat sink concept in electronic cooling", International Journal of Heat and Mass Transfer, 42, pp. 2287-2297
11. th ed., New York, Wiley, pp. 482-490
12. Shah, R.K., and A.L. London, 1978, Laminar flow forced convection in ducts, (Supp. 1) in advances in heat transfer, in: T.F. Irvine, J.P. Hartnett, Academic, New York, pp. 96-98
13. Moffat, R.J., "Describing the uncertainties in experimental results, Exp. Thermal Fluid Sci. 1 (1988) 3-17.
14. Issa, J.S., Ortega, A., "Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins," Proc., IMECE2002, ASME International Engineering Congress & Exposition, New Orleans, Louisiana, Paper # 34244.