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Volumn 2, Issue , 2004, Pages 1547-1551

Demonstration of 2.5Gb/s optical interconnection using 45°-ended connection blocks in fiber- And waveguide-embedded PCBs

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECTION TECHNIQUES; OPTICAL CONNECTING RODS; OPTICAL LAYERS; POLYMER MATERIALS;

EID: 10444246594     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (11)
  • 1
    • 0000852922 scopus 로고    scopus 로고
    • Optical interconnections in systems
    • Levi, A. F. J., "Optical interconnections in systems," Proceedings of the IEEE, Vol. 88, (2000) pp. 750-757.
    • (2000) Proceedings of the IEEE , vol.88 , pp. 750-757
    • Levi, A.F.J.1
  • 3
    • 0036706583 scopus 로고    scopus 로고
    • Linking with light
    • Savage, N., "Linking with light," IEEE Spectrum, Vol. 39, (2002) pp. 32-36.
    • (2002) IEEE Spectrum , vol.39 , pp. 32-36
    • Savage, N.1
  • 6
    • 0042361743 scopus 로고    scopus 로고
    • New architecture of optical interconnection using 45o-ended connection rods in waveguide-embedded printed circuit boards
    • San Jose, CA
    • Rho, B. S., Cho, H. S., Eo, J. -Y., Kang, S. -K., Park, H. -H., Kim, Y. W., Joe, Y. S., and Yang, D. J., "New architecture of optical interconnection using 45o-ended connection rods in waveguide-embedded printed circuit boards," Photonics Packaging and Integration V, San Jose, CA, (2003) pp. 71-78.
    • (2003) Photonics Packaging and Integration V , pp. 71-78
    • Rho, B.S.1    Cho, H.S.2    Eo, J.Y.3    Kang, S.K.4    Park, H.H.5    Kim, Y.W.6    Joe, Y.S.7    Yang, D.J.8
  • 7
    • 0037674521 scopus 로고    scopus 로고
    • Demonstration of on-PCB optical interconnection using surface-mount package and polymer waveguide
    • Ishii, Y., Hayashi, T., and Takahara, H., "Demonstration of on-PCB optical interconnection using surface-mount package and polymer waveguide, " Electronic Components and Technology Conference 2003, (2003) pp. 1147-1152.
    • (2003) Electronic Components and Technology Conference 2003 , pp. 1147-1152
    • Ishii, Y.1    Hayashi, T.2    Takahara, H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.