Does nanocrystalline Cu deform by Coble creep near room temperature?

Materials Science and Engineering: A

Volumn 387-389, Issue 1-2 SPEC. ISS., 2004, Pages 585-589

  Li, Yujiao J ^a   Blum, W ^a   Breutinger, F ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Coble creep; Dislocation annihilation; Grain boundaries; Nanocrystalline Cu; Strain rate sensitivity; Ultrafine grained Cu

Indexed keywords

COMPRESSION TESTING; COPPER; CREEP; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS;

COMPRESSION STRESS; ELECTRO DEPOSITION (ED); TENSILE FRACTURE;

NANOSTRUCTURED MATERIALS;

COPPER;

EID: 10444229622     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.11.086     Document Type: Article

References (13)

1. Cai B. Kong Q.P. Lu L. Lu K. Mater. Sci. Eng. A 286 2000 188
2. Conrad H. Mater. Sci. Eng. A 341 2003 216
3. Lu L. Sui M.L. Lu K. Science 287 2000 1463
4. Lu L. Wang L.B. Ding B.Z. Lu K. Mater. Sci. Eng. A 286 2000 125
5. Höppel H.W. Zhou Z.M. Mughrabi H. Valiev R.Z. Philos. Mag. A 82 2002 1781
6. Straub S. Blum W. Maier H.J. Borbély A. Ungár T. Renner H. Acta Mater. 44 1996 4337
7. Weidinger P. Blum W. Hunsche U. Hampel A. Phys. Stat. Sol. (a) 156 1996 305
8. Zhu Q. McQueen H. J.Blum W. High 17 1998 289
9. Blum W. Reppich B. Acta Metall. 17 1969 959
10. Valiev R.Z. Alexandrov I.V. Zhu Y.T. Lowe T.C. J. Mater. Res. 171 2002 5
11. Jia D. Ramesh K.T. Ma E. Lu L. Lu K. Scripta Mater. 45 2001 613
12. Blum W. in: H. Mughrabi (Ed.), Plastic Deformation and Fracture of Materials, vol. 6, in: R.W. Cahn, P. Haasen, E.J. Kramer (Eds.), Materials Science and Technology, VCH Verlagsgesellschaft, Weinheim, 1993, p. 359.
13. Blum W. Eisenlohr P. Breutinger F. Metall. Trans. 33A 2002 291