Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

Scripta Materialia

Volumn 45, Issue 5, 2001, Pages 613-620

  Jia, D ^a   Ramesh, K T ^a   Ma, E ^a   Lu, L ^b   Lu, K ^b  

^a Johns Hopkins University   (United States)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Grain boundary; High strain rate; nc copper; Stress strain curve; TEM

Indexed keywords

COMPRESSION TESTING; COMPRESSIVE STRENGTH; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS; PLASTIC FLOW; STRAIN HARDENING; STRAIN RATE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

QUASISTATIC STRAIN RATE;

COPPER;

EID: 0035850589     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(01)01071-5     Document Type: Article

References (17)