P+ silicon recessed micromechanical structures for MEMS applications

DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Volumn , Issue , 2003, Pages 378-381

  Pal, P ^a   Tuli, S ^a   Chandra, S ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Accelerometers; Anisotropic magnetoresistance; Electrodes; Electrostatic actuators; Etching; Micromechanical devices; Silicon; Structural beams; Temperature sensors; Visualization

Indexed keywords

EID: 10444225097     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2003.1287072     Document Type: Conference Paper

References (9)

1. P.Rai Choudhury (ed.), "MEMS and MEOMS technology and applications." SPIE Press, Bellingham, 2000.
2. A.P. Malshe, Chad O Neal, Sushila B. Singh "Challenges in the Packaging of MEMS." The International Journal of Microcircuits and Electronics Packaging, vol. 22, No. 3, pp. 233-241, 1999.
3. D. Craven, "Photolithography Challenges for Macromachining Industry," BACUS symposium, 1996.
4. S. Linder, H. Baltes, F. Gnaedinger, E. Doering, "Photolithography in Anisotropically Etched Grooves," Proceeding of IEEE Micromachining Workshop III, pp. 38-43, 1998.
5. Sudhir Chandra et al., "Design and Development of Microstructures for MEMS Applications", SPIE vol. 3226, pp. 22-30, Texas, 1997.
6. P. Kersten, S. Bouwstra, J.W. Petersen, "Photolithography on Micromachined 3D Surfaces using Electrodeposited Photoresist." Sensors and Actuators, A 51, pp. 51-54, 1995.
7. Matthias Heschel, Siebe Bouwstra, "Conformal Coating by Photoresist of Sharp Comers of Anisotropically Etched Through-holes in Silicon." Sensors and Actuators, A 70, pp. 75-80, 1998.
8. Spray Coating Covers Tough Topography, Solid state technology, vol. 42 (6), pp. 24, 1999.
9. Janak Singh, "Some Aspects of Silicon Micromachining Technology for MEMS Applications" PhD. thesis, IIT Delhi, INDIA, 1998.