Cracking and decohesion of a thin Al2O3 film on a ductile Al-5%Mg substrate

Acta Materialia

Volumn 53, Issue 2, 2005, Pages 477-485

  Xie, Changjin ^a   Tong, Wei ^a  

^a Yale University   (United States)

Author keywords

Aluminum; Anodization; Atomic force microscopy; Tension test; Thin film coating

Indexed keywords

ALUMINA; ANODIC OXIDATION; ATOMIC FORCE MICROSCOPY; BRITTLENESS; COATINGS; CRACK INITIATION; DUCTILITY; INTERFACES (MATERIALS); MAGNESIUM PRINTING PLATES; SCANNING ELECTRON MICROSCOPY; THIN FILMS;

ANODIZATION; COATING FRACTURE STRESS; TENSION TEST; THIN FILM COATING;

POLYCRYSTALLINE MATERIALS;

EID: 10044250898     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.10.005     Document Type: Article

References (35)

1. Keller F, Hunter MS, Robinson DL. J Electrochem Soc 1953; 100:110.
2. Edeleanu C, Law TJ. Phil Mag 1962;7:573.
3. Bradhurst DM, Leach JSL. J Electrochem Soc 1966;113:1245.
4. Grosskerutz JC, McNeil MB. J Appl Phys 1969;40:355.
5. Hockenhull BS, Gupta SS, Hurst RC. Trans Inst Metal Finish 1976;54:123.
6. Hu MS, Evans AG. Acta Metall 1989;37:917.
7. Hutchinson JW, Suo Z. Mixed mode cracking in layered materials. Advances in applied mechanics, vol. 29. San Diego: Academic Press; 1992. p. 63.
8. Ye T, Suo Z, Evans AG. Int J Solid Struct 1992;29:2639.
9. Dauskardt RH, Lane M, Ma Q, Krishna N. Eng Fract Mech 1998;61:141.
10. Müler D, Fromm E. Thin Solid Film 1995:270:411.
11. Yang QD, Thouless MD, Ward SM. J Mech Phys Solid 1999;47:1337.
12. Chechenin NG, Bottiger J, Krog JP. Thin Solid Film 1995:261:219.
13. Kriese MD, Boismier DA, Moody NR, Gerberich WW. Eng Fract Mech 1998;61:1.
14. Pang M, Wilson DE, Bahr DF. Mater Res Soc Symp Proc 2000;594:501.
15. Abdul-Baqi A, Van Der Giessen E. Thin Solid Film 2001;381: 143.
16. Agrawal DC, Raj R. Acta Metall 1989:37:1265.
17. Jeong JH, Kwon D. J Adhesion Sci Technol 1998;12:29.
18. Tong W, Hector LG, Weiland H, Wiserman LF. Unpublished work; 1997.
19. Xie C, Li X, Tong W, Hector LG, Weiland H, Wieserman LF. In: Proceedings of the SEM IX international congress on experimental mechanics, Orlando, FL; 2000. p. 16.
20. Cairns DR, Sachsman SM, Sparacin DK, Witte II RR, Crawford GP, Paine DC. Mater Res Soc Symp Proc 2000;594:401.
21. Delannay F, Warren P. Acta Metall Mater 1991;39:1061.
22. Needleman A. Int J Fract 1990;42:21.
23. Baney JM, Hui CY. J Adhesion Sci Technol 1997;11:393.
24. Tvergaard V. Eng Frac Mech 2003:70:1859.
25. Tong W. Exp Mech 1997;37:452.
26. Tong W, Hector LG, Weiland H, Wiserman LF. Scripta Mater 1997;36:1339.
27. Tong W. J Mech Phys Solid 1998;46:2087.
28. Hertzberg RW. Deformation and fracture mechanics of engineering materials. 4th ed., New York: Wiley; 1995.
29. Beuth JL, Klingbeil NW. J Mech Phys Solid 1996;44:1411.
30. Wang JS, Sugimura Y, Evans AG, Tredway WK. Thin Solid Films 1998:325:163.
31. Cotterell B, Chen Z. Int J Fract 2000;104:169.
32. Yu H, Hutchinson JW. Int J Fract 2002; 113:39.
33. Agrawal DC, Raj R. Mater Sci Eng A 1990:126:125.
34. Shieu FS, Raj R, Sass SL. Acta Metall Mater 1990;38: 2215.
35. Chen BF, Hwang J, Yu GP, Hunag JH. Thin Solid Film 1999;352:173.