Wideband average power handling capability of coupled microstrips on polyimide and polyimide/GaAs substrates

IEE Proceedings: Microwaves, Antennas and Propagation

Volumn 151, Issue 5, 2004, Pages 385-392

  Yin, W Y ^a   Dong, X T ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LOSSES; HEAT LOSSES; MATHEMATICAL MODELS; POLYIMIDES; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; THERMAL CONDUCTIVITY;

AVERAGE POWER HANDLING CAPABILITIES; COUPLED MICROSTRIPS;

MICROSTRIP LINES;

EID: 10044223344     PISSN: 13502417     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1049/ip-map:20040761     Document Type: Article

References (21)

1. 5 /polyimde antiresonant reflecting optical waveguides', IEEE Photonics. Technol. Lett., 2000, 12, pp. 1192-1194
2. Kang, J.W., Kim, J.J., Kim, J., Li, X., and Lee, M.: 'Low-loss and thermally stable TE-mode selective polyimide waveguide using photosensitive fluorimated polyimide', IEEE Photonics Technol. Lett. 2002, 14, pp. 1297-1299
3. Ramadoss, R., Lee, S., Lee, Y.C., Bright, V.M., and Gupta, K.C.: 'Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology', IEEE Trans. Adv. Packag., 2003, 26, pp. 248-254
4. Kim, J., Qian, Y., Feng, G., Ma, P., Chang, M.F., and Itoh, T.: 'Millimeter-wave silicon MMIC interconnect and coupler using multiple polyimide technology', IEEE Trans. Microw. Theory Tech., 2000, 48, pp. 1482-1487
5. Bahl, I.J.: 'High performance inductors', IEEE Trans. Microw. Theory Tech., 2001, 49, pp. 654-664
6. Park, S.K., Kim, Y.H., Han, J.I., Moon, D.G., and Kim, W.K.: 'High performance polymer TFTs printed on a plastic substrate', IEEE Trans. Electron Devices, 2002, 49, pp. 2008-2015
7. Sugitani, S., Ishii, T., and Tokumitsu, M.: 'Three-dimensional interconnect with excellent moisture resistance for low-cost MMICs', IEEE Trans. Adv. Packag., 2003, 26, pp. 133-140
8. Nishibe, Y., Yamadera, H., Ohta, N., Tsukada, K., and Ohmura, Y.: 'Magneto-impedance effect of a layered CoNbZr amorphous film formed on a polyimide substrate', IEEE Trans. Magn., 2003, 39, pp. 571-575
9. Yin, W.Y., Pan, S.J., Li, L.W., and Gan, Y.B.: 'Model description and parameter extraction of on-chip spiral inductors for MMICs', Int. J. RF Microw. Comput. Aided Eng., 2004, 14, pp. 111-121
10. Ponchak, G.E., and Downey, A.N.: 'Characterization of thin film microstrip lines on polyimide', IEEE Trans. Compon. Packag. Manuf. Technol. B, Adv. Packag., 1998, 21, pp. 171-176
11. Ponchak, G.E., Mangomenos, A., and Katehi, L.P.B.: 'Low-loss CPW on low-resistivity Si substrates with a micromachined polyimide interface layer for RFIC interconnects', IEEE Trans. Microw. Theory Tech., 2001, 49, pp. 866-870
12. Bahl I.J.: 'Average power handling capability of multiplayer microstrip lines', Int. J. RF Microw. Comput. Aided Eng., 2001, 11, pp. 385-395
13. Gupta, K.C., Garg, R., Bahl, I.J., and Bhartia, P.: 'Microstrip lines and slotlines' (Artech House Publ, 1996)
14. Kirschning, M., and Jansen, R.H.: 'Accurate wide-range design equations for the frequency-dependent characteristics of parallel coupled microstrip lines', IEEE Trans. Microw. Theory Tech., 1984, 32, pp. 83-90
15. Kirschning, M., and Jansen, R.H.: 'A correction to: Accurate wide-range design equations for the frequency-dependent characteristics of parallel coupled microstrip lines', IEEE Trans. Microw. Theory Tech., 1985, 33, p. 288
16. Jansen, R.H.: 'High-speed computation of single and coupled microstrip parameters including dispersion, high-order modes, loss and finite strip thickness', IEEE Trans. Microw. Theory Tech., 1978, 26, pp. 75-82
17. Verma, A.K., and Nasimuddin,: 'Determination of conductor loss of multilayer-coupled microstrip lines for CAD applications', Microw. Opt. Technol. Lett., 2003, 38, pp. 409-415
18. Verma, A.K., Nasimuddin, and Bhupal, A.: 'Dielectric loss of multilayer coupled microstrip line using SLR formulation', Microw. Opt. Technol. Lett., 2001, 31, pp. 65-67
19. Masana, F.N.: 'A closed-form solution of junction of substrate thermal resistance in semiconductor chips', IEEE Trans. Compon. Packag. Manuf. Technol. A., 1996, 19, pp. 539-545
20. Yin, W.Y., Dong, X.T., and Gan, Y.B.: 'Frequency-dependent maximum average power handling capability of an edge-coupled microstrip lines on LTCC substrates', Int. J. RF Microw. Comput. Aided Eng., 2005, 15(1), (accepted for publication)
21. Walkey, D.J., Smy, T.J., Macelwee, T., and Malieparrd, M.: 'Compact representation of temperature and power dependence of thermal resistance in Si, InP, and GaAs substrate devices using linear models', Solid-State Electron., 2002, 46, pp. 819-826