The formation of sp3 bonding in compressed BN

Nature Materials

Volumn 3, Issue 2, 2004, Pages 111-114

  Meng, Yue ^a,b   Mao, Ho Kwang ^b   Eng, Peter J ^c   Trainor, Thomas P ^c,e   Newville, Matthew ^c   Hu, Michael Y ^a,b   Kao, Chichang ^d   Shu, Jinfu ^b   Hausermann, Daniel ^a,b   Hemley, Russell J ^b  

^a ARGONNE NATIONAL LABORATORY   (United States)

^b GEOPHYSICAL LABORATORY   (United States)

^c UNIVERSITY OF CHICAGO   (United States)

^d BROOKHAVEN NATIONAL LABORATORY   (United States)

^e UNIVERSITY OF ALASKA FAIRBANKS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BORON COMPOUNDS; ELECTRON ENERGY LOSS SPECTROSCOPY; ELECTRONIC STRUCTURE; HARDNESS; METALLIZING; POLYMERIZATION; QUENCHING; RAMAN SPECTROSCOPY; SUPERCONDUCTIVITY;

HEXAGONAL BORON NITRIDE; HEXAGONAL CLOSE-PACKED POLYMORPH; INELASTIC X RAY SCATTERING; SOFT X RAY ABSORPTION SPECTROSCOPY;

CHEMICAL BONDS;

BORON DERIVATIVE; ELBOR;

ARTICLE; CHEMISTRY; MATERIALS; METHODOLOGY; SPECTROSCOPY;

BORON COMPOUNDS; CHEMISTRY, ANALYTICAL; MANUFACTURED MATERIALS; SPECTRUM ANALYSIS;

EID: 0842321942     PISSN: 14761122     EISSN: None     Source Type: Journal    
DOI: 10.1038/nmat1060     Document Type: Letter

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