The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

Microelectronics Reliability

Volumn 38, Issue 10, 1998, Pages 1539-1545

  Ousten, Y ^a   Mejdi, S ^a   Fenech, A ^a   Deletage, J Y ^a   Bechou, L ^a   Perichaud, M G ^a   Danto, Y ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0742282965     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00060-2     Document Type: Article

References (9)

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4. Mejdi S, Bechou L, Ousten Y, Danto Y, Lozano L, Dussault J. Evaluation of MLCC (TYPE II) by using accelerated life test and impedance spectroscopy. CART's Europe 1996.
5. Bechou L, Mejdi S, Ousten Y, Danto Y. Non-destructive detection and localization of defects in multilayer ceramic capacitors using electromechanical resonances. Quality Reliability Engng Int 1996;12:43-53.
6. Fenech A, Hijazi A, Danto Y. Determination of thermomechanical behaviour of microelectronics packaging based on microstructural analysis. ESREF Glasgow, 1994.
7. Lau JH, Rio DW. Solder joint failure in surface mount technology. Solid State Technol. 1985;91-100.
8. Kotlowitz RW. Compliance metrics for surface mount component lead design. Proceeding IEEE Electronic Components and Technology Conference, Las Vegas, NV 1990;vol. 2:1054-63.
9. Deletage JY, Fenech A, Bechou L, Ousten Y, Danto Y, Salagoity M, Faure C, Rao S. Thermomechanical behaviour of ceramic BGA based on experiments and FEM simulations. In: Proceedings of the 1996, IEMT Symposium, Austin, USA, 1996. p. 91-98.