Non-destructive detection and localization of defects in multilayer ceramic chip capacitors using electromechanical resonances

Quality and Reliability Engineering International

Volumn 12, Issue 1, 1996, Pages 43-53

  Bechou, L ^a,b,c   Mejdi, S ^a,b,c   Ousten, Y ^a,b,c   Danto, Y ^a,b,c,d  

^a CNRS   (France)

^b University Bordeaux I ^*

^c UNIVERSITÉ DE BORDEAUX   (France)

^d Failure Anal and Reliability Group

Author keywords

Electromechanical resonances; Motional parameters; Multilayer ceramic chip capacitor; Non destructive failure analysis; Piezoelectricity

Indexed keywords

DEFECTS; FAILURE ANALYSIS; NONDESTRUCTIVE EXAMINATION; PIEZOELECTRICITY; RELIABILITY; RESONANCE; SOLDERING; SURFACE MOUNT TECHNOLOGY;

ELECTROMECHANICAL RESONANCES; MOTIONAL PARAMETERS; MULTILAYER CERAMIC CHIP CAPACITORS; NON DESTRUCTIVE FAILURE ANALYSIS;

CERAMIC CAPACITORS;

EID: 0029735076     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1638(199601)12:1<43::AID-QRE981>3.0.CO;2-O     Document Type: Article

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